Electronic package and fabrication method thereof

ABSTRACT

An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

CROSS-REFERENCE TO RELATED APPLICATIONS

[Para 1] This application claims priority to Taiwan Application SerialNo.109111986, filed on Apr. 9, 2020. The entirety of the above-mentionedpatent application is hereby incorporated by reference herein and made apart of this specification.

BACKGROUND 1. Technical Field

[Para 2] The present disclosure relates to packaging processes, and moreparticularly, to an electronic package having an antenna function and afabrication method thereof.

2. Description of Related Art

[Para 3] Along with the rapid development of electronic industries,electronic products are developed toward the trend of multi-function andhigh performance. Current fourth generation (4G) wireless communicationtechnologies have been widely applied in various consumer electronicproducts for facilitating receiving or transmission of various wirelesssignals.

[Para 4] However, along with the rapid development of wirelesscommunication and increased network resources, the required wirelesscommunication bandwidth becomes larger and larger. Therefore, theresearch and development of fifth generation (5G) wireless transmissionhave become a trend.

[Para 5] FIG. 1 is a schematic perspective view of a conventionalwireless communication device. As shown in FIG. 1 , the wirelesscommunication device 1 comprises: a circuit board 10 with electronicelements 11 disposed thereon, a plurality of chip elements 16 disposedon and electrically connected to the circuit board 10, an antennaelement 12 electrically connected to the chip elements 16 through atransmission line 17, and an encapsulant 13 encapsulating the chipelements 16 and a portion of the transmission line 17.

[Para 6] However, in the conventional wireless communication device 1,to enhance signal strength, the antenna element 12 for 5G needs to bedisposed near a housing of a portable electronic product. Therefore, theportable electronic product has a limited space available for theantenna element 12 and further the miniaturization requirement of thewireless communication device 1 needs to be met. In addition, how toestablish electrical communication between the wireless communicationdevice 1 disposed near the housing and other components (e.g., amainboard) disposed in the center of the portable electronic product isa problem to be solved.

[Para 7] Therefore, how to overcome the above-described drawbacks of theprior art has become an urgent issue in the art.

SUMMARY

[Para 8] In view of the above-described drawbacks, the presentdisclosure provides an electronic package, which comprises: a carrierstructure having an antenna function; an electronic element disposed onand electrically connected to the carrier structure; a lead framedisposed on the carrier structure and having a plurality of conductiveposts separated from one another, wherein the plurality of conductiveposts are electrically connected to the carrier structure; and anencapsulant disposed on the carrier structure for encapsulating theelectronic element and the lead frame, wherein the encapsulant isdefined with a first encapsulating portion and a second encapsulatingportion that are integrally formed with one another, wherein theelectronic element is positioned in the first encapsulating portion andthe plurality of conductive posts are positioned in the secondencapsulating portion, wherein a height of the first encapsulatingportion is greater than a height of the second encapsulating portion,and wherein end surfaces of the plurality of conductive posts areexposed from a surface of the second encapsulating portion toelectrically connect to a connector.

[Para 9] The present disclosure further provides a method forfabricating an electronic package, which comprises: providing a carrierstructure having an antenna function; disposing and electricallyconnecting at least one electronic element and at least one lead frameonto the carrier structure, wherein the lead frame has a plurality ofconductive posts separated from one another; and forming an encapsulanton the carrier structure for encapsulating the electronic element andthe lead frame, wherein the encapsulant is defined with a firstencapsulating portion and a second encapsulating portion that areintegrally formed with one another, wherein the electronic element ispositioned in the first encapsulating portion and the plurality ofconductive posts are positioned in the second encapsulating portion,wherein a height of the first encapsulating portion is greater than aheight of the second encapsulating portion, and wherein end surfaces ofthe plurality of conductive posts are exposed from a surface of thesecond encapsulating portion to electrically connect to a connector.

[Para 10] In the above-described method, formation of the encapsulantcomprises forming an encapsulating material encapsulating the electronicelement and the lead frame and then removing a portion of theencapsulating material and a portion of the lead frame to form theencapsulant having the first encapsulating portion and the secondencapsulating portion, wherein the end surfaces of the plurality ofconductive posts are exposed from the surface of the secondencapsulating portion.

[Para 11] In the above-described electronic package and method, thecarrier structure comprises a circuit board and an antenna board stackedon one another.

[Para 12] The above-described electronic package and method furthercomprise covering the electronic element with a shielding structure. Forexample, the above-described electronic package and method furthercomprise forming the shielding structure on portions of surfaces of theencapsulant to cover the electronic element and not in contact with theplurality of conductive posts. Further, the lead frame has at least oneconductive wall embedded in the encapsulant, wherein the conductive wallis separated from the plurality of conductive posts, exposed from thesecond encapsulating portion and connected to the shielding structure.Alternatively, the lead frame has at least one conductive block embeddedin the encapsulant, wherein the conductive block is separated from theconductive posts, exposed from the first encapsulating portion andconnected to the shielding structure.

[Para 13] The above-described electronic package and method furthercomprise disposing the connector on the plurality of conductive posts.

[Para 14] The above-described electronic package and method furthercomprise disposing an adapter configured with the connector on theplurality of conductive posts. For example, the adapter is a flexiblecircuit board.

[Para 15] In the above-described electronic package and method, thesecond encapsulating portion is disposed on one side of the carrierstructure.

[Para 16] In the above-described electronic package and method, thesecond encapsulating portion is disposed at a corner of the carrierstructure.

[Para 17] In the above-described electronic package and method, theencapsulant has a plurality of second encapsulating portions, and thefirst encapsulating portion is positioned between two of the secondencapsulating portions.

[Para 18] In the above-described electronic package and method, theencapsulant has a plurality of first encapsulating portions, and thesecond encapsulating portion is positioned between two of the firstencapsulating portions.

[Para 19] According to the present disclosure, since the firstencapsulating portion is higher than the second encapsulating portionand the plurality of conductive posts are exposed from the secondencapsulating portion to serve as contacts, the connector can bedirectly or indirectly integrated into the electronic package asrequired. As such, the antenna of the carrier structure can beelectrically connected to the mainboard of an electronic product with ahigh degree of freedom through the connector, and the carrier structurecan be disposed near the housing of the electronic product according tothe requirement of signal strength. Therefore, if the electronic productadopts the electronic package of the present disclosure, there is nospace limitation on the design of other components, thus allowing theelectronic product to meet all functions as required.

BRIEF DESCRIPTION OF THE DRAWINGS

[Para 20] FIG. 1 is a schematic perspective view of a conventionalwireless communication device;

[Para 21] FIGS. 2A to 2D are schematic cross-sectional viewsillustrating a method for fabricating an electronic package according tothe present disclosure;

[Para 22] FIG. 2A′ is another aspect of FIG. 2A;

[Para 23] FIG. 2D′ is another aspect of FIG. 2D;

[Para 24] FIG. 2D″ is another aspect of FIG. 2D′;

[Para 25] FIGS. 2E and 2E′ are other aspects of FIG. 2D;

[Para 26] FIG. 2E″ is a schematic cross-sectional view illustratingsubsequent application of FIG. 2E;

[Para 27] FIGS. 3A to 3C are schematic upper views illustrating variousaspects of FIG. 2E;

[Para 28] FIGS. 3D and 3E are schematic upper views illustrating otheraspects of FIG. 3A;

[Para 29] FIGS. 3D′ and 3E′ are schematic cross-sectional viewsillustrating addition of a shielding structure to FIGS. 3D and 3E,respectively;

[Para 30] FIG. 4 is a schematic cross-sectional view of an electronicpackage according to another embodiment of the present disclosure; and

[Para 31] FIG. 4 ′ is a schematic upper view of FIG. 4 .

DETAILED DESCRIPTION

[Para 32] The following illustrative embodiments are provided toillustrate the present disclosure, these and other advantages andeffects can be apparent to those in the art after reading thisspecification.

[Para 33] It should be noted that all the drawings are not intended tolimit the present disclosure. Various modifications and variations canbe made without departing from the spirit of the present disclosure.Further, terms such as “first,” “second,” “on,” “a,” etc., are merelyfor illustrative purposes and should not be construed to limit the scopeof the present disclosure.

[Para 34] FIGS. 2A to 2D are schematic cross-sectional viewsillustrating a method for fabricating an electronic package 2 accordingto the present disclosure.

[Para 35] As shown in FIG. 2A, a carrier structure 20 having a firstside 20 a and a second side 20 b opposing the first side 20 a, and atleast one electronic elements 21, 21′ and at least one lead frame 22 aredisposed on the first side 20 a of the carrier structure 20.

[Para 36] In an embodiment, the carrier structure 20 is a packagingsubstrate having a core layer of a circuit structure or a corelesscircuit structure, which has a plurality of circuit layers such asfan-out redistribution layers (RDLs) formed on a dielectric material.The circuit layers can be made of such as copper, and the dielectricmaterial can be made of such as polybenzoxazole (PBO), polyimide (PI),prepreg (PP) and so on. A first area A and a second area B adjacent toone another are defined on the first side 20 a of the carrier structure20. The first area A serves as an action area for disposing theelectronic elements 21, 21′ and the second area B serves as an externalconnection area for disposing the lead frame 22. It should be noted thatthe carrier structure 20 can be other carrier unit for carrying anelectronic element such as a chip. For example, the carrier structure 20is a lead frame, a silicon interposer, or a functional module and notlimited to the above-described examples.

[Para 37] Further, the carrier structure 20 has an antenna function. Forexample, the carrier structure 20 is an antenna substrate having acircuit layer with an antenna function. Alternatively, as shown in FIG.2A, the carrier structure 20′ can be an antenna module formed bystacking a circuit board 201 and an antenna board 202 on one another.The circuit board 201 is positioned on the first side 20 a of thecarrier structure 20′ and the antenna board 202 is positioned on thesecond side 20 b of the carrier structure 20′. The circuit board 201 canbe connected to the antenna board 202 through a plurality of conductors200 made of such as a solder material.

[Para 38] The electronic elements 21, 21′ can be an active element suchas a semiconductor chip (e.g., the electronic element 21), a passiveelement (e.g., the electronic element 21′) such as a resistor, acapacitor or an inductor, or a combination thereof. For example, thesemiconductor chip is flip-chip disposed on and electrically connectedto the circuit layer (not shown) of the first side 20 a of the carrierstructure 20 through a plurality of conductive bumps 210, and anunderfill (not shown) can be formed to encapsulate the conductive bumps210 as required. The conductive bumps 210 can be made of such as asolder material, metal pillars and so on. In another embodiment, theelectronic element 21 can be electrically connected to the circuit layerof the carrier structure 20 through a plurality of bonding wires (notshown) in a wire-bonding manner. In a further embodiment, the electronicelement 21′ can be in direct contact with the circuit layer of thecarrier structure 20. But it should be noted that the manner in whichthe electronic elements 21, 21′ electrically connect the carrierstructure 20 is various and not limited to the above-described examples.

[Para 39] Further, the lead frame 22 comprises a plate 220, a conductivewall 222 and a plurality of conductive posts 221 spacingly disposed onthe plate 220. The lead frame 22 is vertically disposed on the secondarea B of the first side 20 a of the carrier structure 20 through theconductive posts 221 and the conductive wall 222. For example, the leadframe 22 is formed by removing portions of a metal board such as acopper board through etching, laser or the like.

[Para 40] As shown in FIG. 2B, an encapsulating material 23′ is formedon the first side 20 a of the carrier structure 20 to encapsulate theelectronic elements 21, 21′ and the lead frame 22.

[Para 41] In an embodiment, the encapsulating material 23′ is aninsulating material such as polyimide, a dry film, an epoxy resin or amolding compound. For example, the encapsulating material 23′ can beformed on the carrier structure 20 by using a liquid compound,injection, lamination or compression molding.

[Para 42] As shown in FIG. 2C, a portion of the encapsulating material23′ and a portion of the plate 220 of the lead frame 22 are removed toform an encapsulant 23 having a notch. The encapsulant 23 is definedwith a first encapsulating portion 230 positioned on the first area Aand a second encapsulating portion 231 positioned on the second area B.The height H1 of the first encapsulating portion 230 is greater than theheight H2 of the second encapsulating portion 231. As such, theconductive posts 221 and the conductive wall 222 are exposed from thesecond encapsulating portion 231 of the encapsulant 23, and theconductive block 220′ (i.e., the remaining portion of the plate 220) isexposed from a side surface 230 c of the first encapsulating portion230. The conductive posts 221 serve as I/O contacts, and the conductivewall 222 and the conductive block 220′ are used for grounding. Forexample, the conductive wall 222 and the conductive block 220′ areconnected and integrally formed.

[Para 43] In an embodiment, a portion of the plate 220 and a portion ofthe encapsulating material 23′ on the second area B are removed bygrinding, and the encapsulating material 23′ around the conductive posts221 and the conductive wall 222 on the second area B are retained as thesecond encapsulating portion 231. Further, the removal process can beperformed by such as etching, laser or milling and is not limited to theabove-described examples.

[Para 44] Further, the conductive posts 221 can serve as signal pins,SMT contacts and so on. End surfaces of the conductive posts 221 canhave a rectangular shape (as shown in FIG. 3A), a circular shape (asshown in FIG. 3B) and so on.

[Para 45] Furthermore, the range of the second encapsulating portion 231can be adjusted as required. For example, as shown in FIGS. 3A and 3B,the second encapsulating portion 231 covers the entire second area B(i.e., the encapsulant 23 has a stepped shape), or as shown in FIG. 3C,the second encapsulating portion 231 covers a portion of the second areaB (i.e., the first encapsulating portion 330 extends to the second areaB, that is, the encapsulant 23 has a notched corner), so as to adjustthe number of the conductive posts 221 serving as I/O contacts. Further,the number of the lead frame 22 can be increased to adjust the number ofthe conductive posts 221 serving as I/O contacts. For example, as shownin an electronic package 3 of FIGS. 3D and 3D’, two lead frames 22, 32are disposed at two opposite sides of the electronic elements 21, 21′.That is, two opposite sides of the first area A are defined as secondareas B, respectively. As such, the first encapsulating portion 230 ispositioned between two second encapsulating portions 231, 331, and theencapsulant 33 has a convex shape.

[Para 46] In addition, the position of the lead frame 22 can be adjustedaccording to the space requirement of electronic products. For example,as shown in an electronic package 3′ of FIGS. 3E and 3E’, the lead frame22 is disposed away from the side surface 20 c of the second area B ofthe carrier structure 20. Two first encapsulating portions 230, 330 ofthe encapsulant 33′ are positioned on the two opposite sides of thecarrier structure 20 to encapsulate the electronic elements 21, 21′,21″, and the second encapsulating portion 231 is positioned between thetwo first encapsulating portions 230, 330. As such, the encapsulant 33′has a concave shape.

[Para 47] As shown in FIG. 2D, a shielding structure 24 is formed on theencapsulant 23 to cover the electronic elements 21, 21′ so as to protectthe electronic elements 21, 21′ against external electromagneticinterference.

[Para 48] In an embodiment, if needed, the shielding structure 24 cancover the entire or a part (e.g., ½ or ⅓) of the surface of the firstencapsulating portion 230 of the encapsulant 23, or even cover theentire or a part of the side surface 20 c of the first area A of thecarrier structure 20. For example, the shielding structure 24 can extendto the side surface 230 c of the first encapsulating portion 230 so asto come into contact with the conductive block 220′ and even theconductive wall 222. Since the conductive block 220′ and the conductivewall 222 are exposed from the encapsulant 23, the shielding structure 24can be electrically connected to the conductive block 220′ and theconductive walls 222 so as to be connected to a grounding circuit of thecarrier structure 20 through the conductive block 220′ and theconductive walls 222, thereby achieving a shielding effect. It should beunderstood that the shielding structure 24 can also be in contact with acircuit layer of the side surface 20 c of the first area A of thecarrier structure 20 so as to be grounded for achieving the shieldingeffect.

[Para 49] Further, the shielding structure 24 can be formed on theencapsulant 23 by coating of a metal layer (e.g., copper), for example,through sputtering, vaporing, electroplating or electroless plating(chemical plating). Alternatively, the shielding structure 24 can beformed on the encapsulant 23 by covering a metal frame or metal cover,or by foiling. In another embodiment, as shown in an electronic package2′ of FIG. 2D′, a shielding structure 24′ such as a metal frame or metalcover is disposed on the carrier structure 20 to cover the electronicelements 21, 21′ first and then the encapsulant 23 is formed toencapsulate the shielding structure 24′. It should be understood thatvarious shielding methods can be used. For example, as shown in anelectronic package 2″ of FIG. 2D″, at least one shielding portion 240(e.g., of a column shape or a wall shape) is formed between the twoelectronic elements 21, 21′ and electrically connected to the shieldingstructure 24.

[Para 50] Furthermore, as shown in FIG. 2E, if needed, the electronicpackage 2, 2′, 3, 3′ can mount a connector 26 on the conductive posts221 for connecting with a port of the mainboard of an electronicproduct. As such, the electronic package 2 is electrically connected tothe mainboard and integrated into the electronic product. For example,the connector 26 can directly solder or use other manners to dispose onthe conductive posts 221 so as to be electrically connected to theconductive posts 221.

[Para 51] Further, as shown in FIG. 2E′, if needed, the electronicpackage 2, 2′, 3, 3′ can have an adapter 25 connected to the conductiveposts 221, and the connector 26 is disposed on the adapter 25. Forexample, the adapter 25 is a soft or flexible circuit board, which canbe bent as required and soldered onto the conductive posts 221 so as tobe electrically connected to the conductive posts 221. One end of theadapter 25 is connected to the conductive posts 221 and the other end ofthe adapter 25 is connected to the connector 26. As shown in FIG. 2E″,according to the internal space of the electronic product 9, the adapter25 can be bent (to form an angle of about 90 degrees or other degreesbetween the two sides thereof) so as to allow the connector 26 to beconnected onto the port 900 of the mainboard 90 of the electronicproduct 9. As such, the electronic package 2 is electrically connectedto the mainboard 90 and integrated to the electronic product 9. Theelectronic product 9 can have at least one supporting frame 91 forfastening the electronic package 2. Therefore, when the electronicproduct 9 has a limited internal space, the adapter 25 can be bent tofacilitate the design of other components of the electronic product 9.

[Para 52] According to the present disclosure, the encapsulatingmaterial 23′ is ground to form the encapsulant 23 having a notch. Assuch, the conductive posts 221 of the lead frame 22 are exposed from thesecond encapsulating portion 231 of the encapsulant 23 with a lowerheight so as to serve as contacts for electrically connecting with theconnector 26 or for other purposes. Therefore, the connector 26 can bedirectly or indirectly integrated into the electronic package 2, 2′, 3,3′, the antenna (circuit layer or antenna board 202) of the carrierstructure 20, 20′ can be electrically connected to the mainboard 90, andthe carrier structure 20 can be disposed near the housing 9 a of theelectronic product 9 according to the requirement of signal strength. Assuch, compared with the prior art, there is no space limitation on thedesign of other components such as the mainboard 90 inside theelectronic product 9 and the electronic product 9 can meet all functionsas required.

[Para 53] Further, if the connector 26 is directly integrated onto theelectronic package 2, 2′, 3, 3′, power provided by the mainboard 90 canbe directly transmitted to the carrier structure 20, 20′ without passingthrough other transmission path such as the adapter 25, thus avoidingelectrical loss that otherwise would be generated when the power passesthrough the adapter 25. Consequently, the transmission speed isincreased and the electrical performance is improved.

[Para 54] Furthermore, if the electronic package 2, 2′, 3, 3′ ispositioned far from the mainboard 90, the package end can be connectedto the connector 26 through a soft board or hard board type adapter 25so as to increase the degree of position freedom of the electronicpackage 2, 2′, 3, 3′. In addition, by directly soldering the adapter 25to the package end, the required number of the connector 26 (the carrierstructure 20, 20′ does not need the connector) can be reduced, thusreducing the packaging cost.

[Para 55] Further, as shown in FIGS. 4 and 4′, if a peripheral surface421 c of the conductive post 421 is exposed from a side surface 231 c ofthe second encapsulating portion 231 (for example, the peripheralsurface 421 c of the conductive post 421 is flush with the side surface231 c of the second encapsulating portion 231), the conductive post 421can be grounded to achieve a shielding effect. In addition, theconductive post 421 can be electrically connected to other components ofthe system end (i.e., the internal components of the electronic product9) for signal communication and/or grounding, thereby increasing theflexibility of configuration of the electronic package 2, 2′, 3, 3′ andother components of the system end (i.e., the internal components of theelectronic product 9). That is, the side surface 231 c of the secondencapsulating portion 231 of the encapsulant 23 can serve as an externalconnection area.

[Para 56] The present disclosure further provides an electronic package2, 2′, 2″, 3, 3′, 4, which includes: a carrier structure 20, 20′, atleast one electronic elements 21, 21′, a lead frame 22 and anencapsulant 23, 23′, 33, 33′.

[Para 57] The carrier structure 20, 20′ has an antenna function.

[Para 58] The electronic elements 21, 21′ are disposed on andelectrically connected to the carrier structure 20, 20′.

[Para 59] The lead frame 22 is disposed on the carrier structure 20, 20′and has a plurality of conductive posts 221, 421 separated from oneanother, wherein the plurality of conductive posts 221, 421 areelectrically connected to the carrier structure 20, 20′.

[Para 60] The encapsulant 23, 23′, 33, 33′ is formed on the carrierstructure 20, 20′ for encapsulating the electronic elements 21, 21′ andthe lead frame 22, and the encapsulant 23, 23′, 33, 33′ is defined witha first encapsulating portion 230, 330 and a second encapsulatingportion 231, 331 that are integrally formed with one another. Theelectronic elements 21, 21′ are positioned in the first encapsulatingportion 230, 330 and the plurality of conductive posts 221, 421 arepositioned in the second encapsulating portion 231, 331, wherein theheight H1 of the first encapsulating portion 230, 330 is greater thanthe height H2 of the second encapsulating portion 231, 331, and endsurfaces of the plurality of conductive posts 221, 421 are exposed froma surface of the second encapsulating portion 231, 331 so as to beelectrically connected to a connector 26.

[Para 61] In an embodiment, the carrier structure 20′ comprises acircuit board 201 and an antenna board 202 stacked on one another.

[Para 62] In an embodiment, the electronic package 2, 2′, 2″, 3, 3′, 4further includes a shielding structure 24, 24′ covering the electronicelements 21, 21′. For example, the shielding structure 24 is formed onportions of surfaces of the encapsulant 23, covers the electronicelement 21 and is not in contact with the plurality of conductive posts221, 421. Further, the lead frame 22 has at least one conductive wall222 embedded in the encapsulant 23. The conductive wall 222 is separatedfrom the plurality of conductive posts 221, 421, exposed from the secondencapsulating portion 231 and connected to the shielding structure 24′.Alternatively, the lead frame 22 has at least one conductive block 220′embedded in the encapsulant 23. The conductive block 220′ is separatedfrom the conductive posts 221, 421, exposed from the first encapsulatingportion 230 and connected to the shielding structure 24′.

[Para 63] In an embodiment, the connector 26 is disposed on theplurality of conductive posts 221.

[Para 64] In an embodiment, the connector 26 is electrically connectedto the conductive posts 221 through an adapter 25 disposed on theplurality of conductive posts 221. For example, the adapter 25 is aflexible circuit board.

[Para 65] In an embodiment, the second encapsulating portion 231 isdisposed on one side of the carrier structure 20.

[Para 66] In an embodiment, the second encapsulating portion 231 isdisposed at a corner of the carrier structure 20.

[Para 67] In an embodiment, the encapsulant 33 has a plurality of secondencapsulating portions 231, 331, and the first encapsulating portion 230is positioned between two of the second encapsulating portions 231, 331.

[Para 68] In an embodiment, the encapsulant 33′ has a plurality of firstencapsulating portions 230, 330, and the second encapsulating portion231 is positioned between two of the first encapsulating portions 230,330.

[Para 69] Therefore, through the design of the encapsulant, theconductive posts are exposed from the second encapsulating portion toserve as contacts. Hence, the connector can be directly or indirectlyintegrated into the electronic package as required, the antenna of thecarrier structure can be electrically connected to the mainboard of anelectronic product with a high degree of freedom through the connector,and the carrier structure can be disposed near the housing of theelectronic product according to the requirement of signal strength.Therefore, if the electronic product adopts the electronic package ofthe present disclosure, there is no space limitation on the design ofother components, thus allowing the electronic product to meet allfunctions as required.

[Para 70] The above-described descriptions of the detailed embodimentsare to illustrate the preferred implementation according to the presentdisclosure, and it is not to limit the scope of the present disclosure.Accordingly, all modifications and variations completed by those withordinary skill in the art should fall within the scope of presentdisclosure defined by the appended claims.

1. An electronic package, comprising: a carrier structure having anantenna function; an electronic element disposed on and electricallyconnected to the carrier structure; a lead frame disposed on the carrierstructure and having a plurality of conductive posts separated from oneanother, wherein the plurality of conductive posts are electricallyconnected to the carrier structure; and an encapsulant disposed on thecarrier structure for encapsulating the electronic element and the leadframe, wherein the encapsulant is defined with a first encapsulatingportion and a second encapsulating portion that are integrally formedwith one another, wherein the electronic element is positioned in thefirst encapsulating portion and the plurality of conductive posts arepositioned in the second encapsulating portion, wherein a height of thefirst encapsulating portion is greater than a height of the secondencapsulating portion, and wherein end surfaces of the plurality ofconductive posts are exposed from a surface of the second encapsulatingportion to electrically connect to a connector, and wherein the leadfurther has at least one conductive wall embedded in the encapsulant,and wherein the conductive wall is separated from the plurality ofconductive posts and exposed from the second encapsulating portion. 2.The electronic package of claim 1, wherein the carrier structurecomprises a circuit board and an antenna board stacked on one another.3. The electronic package of claim 1, further comprising a shieldingstructure covering the electronic element.
 4. The electronic package ofclaim 3, wherein the shielding structure is formed on portions ofsurfaces of the encapsulant, covers the electronic element and is not incontact with the plurality of conductive posts.
 5. The electronicpackage of claim 4, wherein the conductive wall is connected to theshielding structure.
 6. The electronic package of claim 4, wherein thelead frame further has at least one conductive block embedded in theencapsulant, and wherein the conductive block is separated from theplurality of conductive posts, exposed from the first encapsulatingportion and connected to the shielding structure.
 7. The electronicpackage of claim 1, wherein the connector is disposed on the pluralityof conductive posts.
 8. The electronic package of claim 1, wherein theconnector is electrically connected to the plurality of conductive poststhrough an adapter disposed on the plurality of conductive posts.
 9. Theelectronic package of claim 8, wherein the adapter is a flexible circuitboard.
 10. The electronic package of claim 1, wherein the secondencapsulating portion is disposed on one side of the carrier structure.11. The electronic package of claim 1, wherein the second encapsulatingportion is disposed at a corner of the carrier structure.
 12. Theelectronic package of claim 1, wherein the encapsulant has a pluralityof second encapsulating portions, and wherein the first encapsulatingportion is positioned between two of the second encapsulating portions.13. The electronic package of claim 1, wherein the encapsulant has aplurality of first encapsulating portions, and wherein the secondencapsulating portion is positioned between two of the firstencapsulating portions. 14-17. (canceled)